skm-q170
信步与英特尔联合推出的智能自助模块化标准, intel 6/7代core i3/i5/i7处理器, q170芯片
- 由信步与英特尔联合推出的智能自助模块化标准
- 支持快速定制i/o模块, 满足不同应用需求
- 计算模块维护与升级便捷
- 支持intel 6/7代core i3/i5/i7处理器
- 采用intel q170芯片组
- 3*m.2支持ssd, wifi和movidius模块
- 6*com, 13*usb, 1*intel千兆网口, 支持vpro
- 1*vga, 1*hdmi, 支持双屏异显
规格
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general |
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cpu |
intel® 6th and 7th generation coretm i3/i5/i7, pentium®, celeron® cpu, lga1151 |
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chipset |
intel® q170 chipset, tdp 6w |
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memory |
ddr4-1866/2133, 2*so-dimm, up to 32 gb |
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storage |
2*sata 3.0 |
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expansion interface |
1*pcie x1, 1*m.2 key-e (2230, wifi/bt),
1*m.2 key-m (2280, nvme ssd), 1*m.2 key-e (2230, wifi bt or movidius m.2 module) |
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bios |
ami uefi bios |
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system |
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i/o interface |
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ethernet |
1*intel® 1gbps pcie ethernet controller, rj45 |
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serial |
6*rs232 |
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usb |
2*usb 3.0, 6*usb 2.0 |
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audio |
realtek® alc662 5.1 channel hda codec, with mic/line-out | |
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feature interface |
1*svio header (provides 4*usb, 8*com and wifi/bt with sv-m5-cu) | |
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display |
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display interface |
1*vga: max resolution up to 1920*1200@60hz 1*hdmi 2.0: max resolution up to 4096x2304@60hz |
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multiple display |
dual | |
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mechanical & environment |
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dimension |
compute module: 175*150mm
i/o module: 175*102mm
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power input |
dc 12v | |
| temperature |
operation: 0℃~60℃, storage: -25℃~75℃ |
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relative humidity |
operation: 10%~90%, storage: 5%~95%, non-condensing | |
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