具身智能开发平台hb03
信步具身智能开发平台 hb03 以开创性的“大小脑融合”及模块化设计，整体算力达300tops，尺寸紧凑、可靠性高、便于开发迭代，推动具身智能真正落地到复杂实用场景中
- 基于信步scm(seavo compute module)的具身智能开发平台
- 采用intel core ultra series 2(arrow lake-h)处理器，集成npu和igpu，总算力可达96tops
- 支持mxm扩展显卡, 最高可扩展至300tops算力
- 模块化设计, 灵活定制升级, 便捷原型迭代
- 厚款 150*142*78mm，搭载独立显卡；薄款 150*142*53mm
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general |
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cpu |
intel® core™ ultra processors (series 2) processors, arrow lake-u/h, with npu and igpu, up to 96tops |
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memory |
lpddr5x-7467, 4*sdram, up to 64gb |
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storage |
1*m.2 m-key 2280, pcie4.0 x4 |
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expansion |
1*mxm slot, pcie 4.0 x8, support intel® arc™ b570 graphic card 1*m.2 e-key 2230, pcie x1 usb2.0, support wifi bt 1*m.2 e-key 3042/3052, usb3.0 usb2.0, support 5g/4g module 1*nano sim |
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bios |
ami uefi bios |
| os | windows 10/11 64bit, linux |
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i/o |
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ethernet |
4*intel® i210-at nics with ethercat protocol, type-c 1*intel® gbe controller, rj45 |
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serial |
2*rs485, 2*rs232 |
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usb |
4*usb3.0 type-c |
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gmsl expansion card |
4*gmsl, support quad channel gmsl camera |
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gpio expansion card |
6*gpi, 6*gpo, 2*tgpio, 1*ttl(12v 5v 3.3v) |
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power expansion card |
48v to 12v, 200w |
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mechanical & environment |
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dimension |
max: 150*142*78mm min: 150*142*53mm |
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power input |
1*dc 12±5%, 2p xt30pw-m |
| temperature |
operation: 0℃~60℃, storage: -20℃~75℃ |
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relative humidity |
5%~95%, non-condensing |
